JPS6127154Y2 - - Google Patents
Info
- Publication number
- JPS6127154Y2 JPS6127154Y2 JP12632981U JP12632981U JPS6127154Y2 JP S6127154 Y2 JPS6127154 Y2 JP S6127154Y2 JP 12632981 U JP12632981 U JP 12632981U JP 12632981 U JP12632981 U JP 12632981U JP S6127154 Y2 JPS6127154 Y2 JP S6127154Y2
- Authority
- JP
- Japan
- Prior art keywords
- metal films
- resin sheet
- inductor
- metal
- sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002184 metal Substances 0.000 claims description 33
- 229910052751 metal Inorganic materials 0.000 claims description 33
- 229920005989 resin Polymers 0.000 claims description 16
- 239000011347 resin Substances 0.000 claims description 16
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 3
- 238000009413 insulation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Coils Or Transformers For Communication (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12632981U JPS5832617U (ja) | 1981-08-25 | 1981-08-25 | 自立型インダクタ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12632981U JPS5832617U (ja) | 1981-08-25 | 1981-08-25 | 自立型インダクタ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5832617U JPS5832617U (ja) | 1983-03-03 |
| JPS6127154Y2 true JPS6127154Y2 (en]) | 1986-08-13 |
Family
ID=29920122
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12632981U Granted JPS5832617U (ja) | 1981-08-25 | 1981-08-25 | 自立型インダクタ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5832617U (en]) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4978184B2 (ja) * | 2006-12-21 | 2012-07-18 | セイコーエプソン株式会社 | 半導体装置及び電子機器 |
-
1981
- 1981-08-25 JP JP12632981U patent/JPS5832617U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5832617U (ja) | 1983-03-03 |
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